India’s semiconductor ambitions received another major boost after the Odisha government signed a Memorandum of Understanding (MoU) with Intel and 3DGS to introduce substrate manufacturing technology in the country. Union Electronics and IT Minister Ashwini Vaishnaw welcomed the agreement, calling it an important step toward strengthening India’s semiconductor ecosystem and electronics supply chain. Sharing the development on X, Vaishnaw congratulated the Odisha government, Intel and 3DGS for bringing advanced substrate manufacturing technology to India. He said the partnership would accelerate the growth of the domestic semiconductor industry and support the country’s long-term goal of becoming a global chip manufacturing hub.
The development comes just weeks after the Union Cabinet approved two major semiconductor projects under the India Semiconductor Mission (ISM). These include India’s first commercial mini and micro-LED display facility based on Gallium Nitride (GaN) technology and a semiconductor packaging unit in Gujarat. Together, the projects involve an investment of nearly ₹3,936 crore and are expected to generate employment opportunities for more than 2,200 skilled professionals.
India’s semiconductor roadmap is also moving ahead rapidly. Earlier this year, Vaishnaw stated that four semiconductor plants are expected to be ready by 2026, with two additional facilities planned for 2027. He also indicated that India’s first fabrication unit in Dholera is likely to become operational by 2028. According to the government, the semiconductor mission is being supported by parallel development in machinery, specialty chemicals, industrial gases, and testing infrastructure to build a complete domestic chip ecosystem.
